The Helio X30 is built by TSMC on 10nm FinFET process, which is down from the 20nm process that was used for the Helio X20. This should bring with it significant power savings as the current Android flagships are still on the 14nm / 16nm process whereas the Apple iPhone is expected to come with a 10nm chipset next year.
The MediaTek Helio X30 will come with 4x Cortex A73 cores clocked at 2.8GHz, 4x Cortex A53 cores clocked at 2.2GHz and 2x Cortex A53 cores clocked at 2.0 GHz. MediaTek will be using a PowerVR 7XT quad-core GPU which is the same family that is seen on current iPhones and iPads.
The Helio X30 is expected to support 8GB of LPDDR4 RAM, UFS 2.1 storage, dual cameras going up to 26MP. The chipset will also comes with Cat. 12 modem with three carrier integration.
Devices sporting the Helio X30 will only be expected to release by June/July next year.